Amkor Technology Inc

Amkor Technology Inc is a OSAT (outsourced semiconductor assembly and test) service provider. It has pioneered the outsourcing of integrated circuit (IC) packaging and test services and is a strategic manufacturing partner for the semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs). The firm's products are organized into two categories namely advanced products that include flip chip, fine pitch bumping, wafer-level processing, advanced SiPs, power modules, and others, and Mainstream products that includes wirebond packaging and testing. The company derives maximum revenue from the advanced products category. The company derives majority of its revenue from Foreign states.